Thermal imaging has gone mainstream. In 2014, FLIR launched a thermal infrared camera so tiny, low-power and inexpensive that it has been integrated into a cellphone—the CAT S60. The cost point is achieved by using high-volume manufacturing processes and materials developed for mobile phone cameras, including packaging, calibration and assembly. Based on the smaller sizes and lower costs, micro-miniature, thermal cameras can now be used in applications that were unthinkable even a few years ago: non-contact thermometers integrated in smartphones, new gestural and thermal touch user interfaces, wearable spectrometers, IoT climate control and care devices, and people counting.
FLIR Lepton Micro-Thermal Camera
The Lepton is a micro-thermal imaging camera that produces a stream of longwave infrared (LWIR) images that are 80x60 pixels in size at a frame rate of <9 Hz. Realizing a thermal camera that is small enough to be integrated into a mobile-phone is the next step in a rapid evolution in infrared camera technology that has taken place over the last 15 years. FLIR has led to a dramatic reduction in the size, weight, power and cost of thermal imaging cameras, making them more accessible to manufacturers to integrate into devices. This trend is illustrated in Figure 1, which shows the reduction in the size of FLIR thermal camera cores that has taken place from 2010 to 2014.
For IoT thermal devices, cloud computing offers the possibility of maintaining low local power dissipation, small installed footprint and low cost
Lepton is innovative in every aspect and required a significant investment in technology development. These are some of the key technology advances used in the design: very low cost lenses built in a novel high-volume wafer-level process, wafer-level packaging of sensors to reduce camera size and number of manufacturing steps, high-speed automated camera assembly and calibration with minimal touch labor, and single-chip camera electronics to reduce size, power requirements and number of interconnects.
Thermal Sensors Everywhere
Because of the recent reductions in size, power and cost of thermal sensors, many never-before-possible high-volume applications are emerging. The Internet of Things (IoT) can be defined as the aggregation of all the sensing modules which are linked to the Cloud. Yole (Lyon, France) expects the total IoT market sensor volume to be 11.8 billion units by 2024.


